Characterisation and energy storage performance of 3D printed-photocurable resin/microencapsulated phase change material composite

dc.contributor.authorEr, Yusuf
dc.contributor.authorGuler, Onur
dc.contributor.authorUstaoğlu, Abid
dc.contributor.authorHekimoglu, Gokhan
dc.contributor.authorSari, Ahmet
dc.contributor.authorSubasi, Serkan
dc.contributor.authorGençel, Osman
dc.contributor.authorGençel, Osman
dc.contributor.authorUstaoğlu, Abid
dc.date.accessioned2025-10-18T09:58:47Z
dc.date.created2024
dc.date.issued2024
dc.departmentFakülteler, Mühendislik Mimarlık ve Tasarım Fakültesi, Makine Mühendisliği Bölümü
dc.departmentFakülteler, Mühendislik Mimarlık ve Tasarım Fakültesi, İnşaat Mühendisliği Bölümü
dc.description.abstractThe 3D fabrication of microencapsulated phase change material (MEPCM) doped resin polymer composites enables the creation of complex shapes and customized designs, opening doors for many applications in fields. This investigation fabricated a range of resin/MEPCM (20 %, 30 %, and 40 % by volume) composites using a mechanical mixing technique. This study investigates how the addition of MEPCM impacts resin matrix composite's mechanical strength, latent heat storage characteristics, and ability to regulate temperature effectively. With a 40 % MEPCM additive ratio, a pure resin porosity value of approximately 0.4 % increased to around 17 %. Thanks to the production of homogeneously dispersed MEPCM added resins with production with stereolithography (SLA), 40 % MEPCM additive enabled characteristic FTIR peaks of both MEPCM and resin to appear and, melting and solidification enthalpy values reached 87.15 j/g and 86.25 j/g, respectively. MEPCM addition enhanced the thermoregulatory properties of resin by absorbing or releasing heat during temperature fluctuations. On hotter days, 8 mm-thick composites create temperature differences exceeding 11 C, while this difference exceeds 6 C in the room center case. The produced 3D printed MEPCM/resin composite can be a potential material to effectively regulate the temperature of electronic devices, food packets, building materials, and electronic devices and automotive components.
dc.identifier.doi10.1016/j.tsep.2023.102381
dc.identifier.issn2451-9049
dc.identifier.orcidGULER, Onur/0000-0002-9696-3287
dc.identifier.orcidHekimoglu, Gokhan/0000-0002-0991-6897
dc.identifier.orcidMarasli, Muhammed/0000-0003-2684-1003
dc.identifier.orcidSubasi, Serkan/0000-0001-7826-1348
dc.identifier.orcidUSTAOGLU, Abid/0000-0003-3391-5015;
dc.identifier.scopus2-s2.0-85183353597
dc.identifier.scopusqualityQ1
dc.identifier.urihttps://doi.org/10.1016/j.tsep.2023.102381
dc.identifier.urihttps://hdl.handle.net/11772/19861
dc.identifier.volume48
dc.identifier.wosWOS:001155906800001
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherElsevier
dc.relation.ispartofThermal Science and Engineering Progress
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.relation.sdgGoal-09: Industry Innovation And Infrastructure
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzWoS_20251016
dc.subjectStereolithography
dc.subjectPhotocurable Resin
dc.subject3d Printing
dc.subjectMicroencapsulated Phase Change Material
dc.subjectThermal Energy Storage
dc.titleCharacterisation and energy storage performance of 3D printed-photocurable resin/microencapsulated phase change material composite
dc.typeArticle
dspace.entity.typePublication
relation.isAuthorOfPublication514d779e-b53b-47d7-a8d8-5e07c2799629
relation.isAuthorOfPublication831ef1cf-f629-4a76-966d-53534977a411
relation.isAuthorOfPublication.latestForDiscovery514d779e-b53b-47d7-a8d8-5e07c2799629

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