The Effect of Mat Layers Moisture Content on Some Properties of Particleboard

Abstract

In this study, the effect of mat moisture content on the physical and mechanical properties of particleboard was investigated. The experimental boards were produced by using 40 % softwood, 45 % hardwood chips, and 15 % sawdust. The formaldehyde resin/adhesive was used in three-layers (bottom-top layer 12 %, core layer 8 %). Multi-opening press was used during manufacturing the experimental particleboards. The physical and mechanical properties of boards obtained were identified according to the TS-EN standards. The optimum core layer moisture content was determined as 6 % and 7 % according to the results, whereas the moisture content of bottom and top layers was 14 %. Under these moisture content conditions, the bending strength was found to be 13.3 N/mm(2), the modulus of elasticity in bending 2466 N/mm(2), and internal bonding strength 0.44 N/mm(2). The optimum bottom-top layer moisture content was determined to be between 13 % and 15 % and 6.5 % for the core layer.