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Comparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe:Cu Ratio

dc.contributor.authorUmut Sarac,M. Celalettin Baykul
dc.date.accessioned2023-02-10T12:33:07Z
dc.date.available2023-02-10T12:33:07Z
dc.date.issued2013
dc.identifier10.1155/2013/971790
dc.identifier.issn1687-8442
dc.identifier.urihttps://dx.doi.org/10.1155/2013/971790
dc.identifier.urihttp://hdl.handle.net/11772/10855
dc.sourceADVANCES IN MATERIALS SCIENCE AND ENGINEERING
dc.subjectGeneral Engineering
dc.titleComparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe:Cu Ratio
dc.typeArticle
dc.identifier.volume2013
dc.identifier.issue0


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