dc.contributor.author | Umut Sarac,R. Mustafa Oksuzoglu,M. Celalettin Baykul | |
dc.date.accessioned | 2023-02-10T12:33:15Z | |
dc.date.available | 2023-02-10T12:33:15Z | |
dc.date.issued | 2012 | |
dc.identifier | 10.1007/s10854-012-0709-6 | |
dc.identifier.issn | 1573-482X | |
dc.identifier.uri | https://dx.doi.org/10.1007/s10854-012-0709-6 | |
dc.identifier.uri | http://hdl.handle.net/11772/10878 | |
dc.source | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | |
dc.subject | Electrical and Electronic Engineering | |
dc.title | Deposition potential dependence of composition, microstructure, and surface morphology of electrodeposited Ni-Cu alloy films | |
dc.type | Article | |
dc.identifier.volume | 23 | |
dc.identifier.issue | 12 | |