Comparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe:Cu Ratio
| dc.contributor.author | Umut Sarac,M. Celalettin Baykul | |
| dc.date.accessioned | 2023-02-10T13:01:51Z | |
| dc.date.available | 2023-02-10T13:01:51Z | |
| dc.date.issued | 2013 | |
| dc.identifier | 10.1155/2013/971790 | |
| dc.identifier.issn | 1687-8442 | |
| dc.identifier.uri | https://dx.doi.org/10.1155/2013/971790 | |
| dc.identifier.uri | http://hdl.handle.net/11772/13504 | |
| dc.source | ADVANCES IN MATERIALS SCIENCE AND ENGINEERING | |
| dc.subject | General Engineering | |
| dc.title | Comparison of Microstructural and Morphological Properties of Electrodeposited Fe-Cu Thin Films with Low and High Fe:Cu Ratio | |
| dc.type | Article | |
| dc.identifier.volume | 2013 | |
| dc.identifier.issue | 0 |
