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Deposition potential dependence of composition, microstructure, and surface morphology of electrodeposited Ni-Cu alloy films

dc.contributor.authorUmut Sarac,R. Mustafa Oksuzoglu,M. Celalettin Baykul
dc.date.accessioned2023-02-10T13:02:03Z
dc.date.available2023-02-10T13:02:03Z
dc.date.issued2012
dc.identifier10.1007/s10854-012-0709-6
dc.identifier.issn1573-482X
dc.identifier.urihttps://dx.doi.org/10.1007/s10854-012-0709-6
dc.identifier.urihttp://hdl.handle.net/11772/13532
dc.sourceJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
dc.subjectElectrical and Electronic Engineering
dc.titleDeposition potential dependence of composition, microstructure, and surface morphology of electrodeposited Ni-Cu alloy films
dc.typeArticle
dc.identifier.volume23
dc.identifier.issue12


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