Evolution of surface roughness parameters and microstructure in two-phase nanocrystalline Co–Cu ﬁlms electrodeposited onto ITO coated glass substrates at different deposition potentials
Baykul, M. Celalettin
MetadataShow full item record
In the present research, we have studied the effect of deposition potential on the ﬁlm composition, structural, and morphological properties of the electrodeposited Co–Cu thin ﬁlms grown onto indium tin oxide coated glass substrates. For this purpose, the properties of the ﬁlms were analyzed by means of X-ray diffraction, energy dispersive X-ray spectroscopy (EDX), and atomic force microscopy (AFM) characterization techniques. Structural characterizations showed that all of the Co–Cu ﬁlms consist of hexagonal close-packed (hcp) Co and facecentered cubic (fcc) Cu phases. The hcp Co (002)/fcc Cu (111) peak intensity ratio was found to increase as the deposition potential decreased towards more negative values. An increase in the Co content in the Co–Cu ﬁlms was observed as the applied deposition potential was made more negative according to EDX analysis. The decrease of the applied deposition potential towards more negative values also induced a decrease in the average crystallite sizes of both Co and Cu particles. AFM study indicated that a granular structure of the electrodeposited Co–Cu ﬁlms regardless of deposition potential. As the applied deposition potential was made more negative, the surface roughness and particle size decreased considerably. Besides, two additional roughness parameters, surface kurtosis and the surface skewness were also obtained and discussed by means of the obtained results under the study.