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dc.contributor.authorSarac, Umut
dc.contributor.authorBaykul, M. Celalettin
dc.date.accessioned2020-02-12T11:38:55Z
dc.date.available2020-02-12T11:38:55Z
dc.date.issued2012
dc.identifier.urihttp://hdl.handle.net/11772/2574
dc.description.abstractA detailed study has been carried out to investigate the effect of applied current density on the composition,crystallographic structure, grain size, and surface morphology of Fe–Cu films. X-ray diffraction (XRD) resultsshow that the films consist of a mixture of face-centered cubic (fcc) Cu and body centered cubic (bcc)α-Fephases. The average crystalline size of both Fe and Cu particles decreases as the applied current densitybecomes more negative. Compositional analysis of Fe–Cu films indicates that the Fe content within the filmsincreases with decreasing current density towards more negative values. Scanning electron microscopy (SEM)and atomic force microscopy (AFM) have been used to investigate the surface morphology of Fe–Cu films. Itis observed that the surface morphology of the films changes from dendritic structure to a cauliflower structureas the applied current density becomes more negative. The surface roughness and grain size of the Fe–Cufilms decrease with decreasing applied current density towards more negative values.en_US
dc.language.isoengen_US
dc.publisherElsevieren_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectElectrodepositionen_US
dc.subjectSurface morphologyen_US
dc.subjectCurrent densityen_US
dc.subjectGrain sizeen_US
dc.subjectCompositionen_US
dc.subjectYüzey morfolojisien_US
dc.titleEffect of applied current density on morphological and structural properties of electrodeposited Fe–Cu filmsen_US
dc.typearticleen_US
dc.relation.journalJournal of Materials Science: Materials in Electronicsen_US
dc.contributor.departmentBartın Üniversitesi, Eğitim Fakültesi, Matematik ve Fen Bilimleri Eğitimi Bölümüen_US
dc.identifier.volume28en_US
dc.identifier.issue11en_US
dc.identifier.startpage1004en_US
dc.identifier.endpage1009en_US


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